1 ? fn6017.2 caution: these devices are sensitive to electrostatic discharge; follow proper ic handling procedures. 1-888-intersil or 321-724-7143 | intersil (and design) is a registered trademark of intersil americas inc. copyright ? intersil americas inc. 2001, 2003, 2004. all rights reserved all other trademarks mentioned are the property of their respective owners. ISL83384E 15kv esd protected, +3v to +5.5v, 1 microamp, 250kbps, rs-232 transmitter/receiver the intersil ISL83384E contains 3.0v to 5.5v powered rs-232 transmitters/receivers which meet ela/tia-232 and v.28/v.24 specifications, even at v cc = 3.0v. targeted applications are pdas, palmto ps, and notebook and laptop computers where the low operational, and even lower standby, power consumption is critical. efficient on-chip charge pumps, coupled with a manual powerdown function reduces the standby supply current to a 1 a trickle. small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. data rates greater than 250kbps are guar anteed at worst case load conditions. this device is fully compatible with 3.3v only systems, mixed 3.3v and 5.0v systems, and 5.0v only systems. the single pin powerdown function (shdn = 0) disables all the transmitters and receivers, while shutting down the charge pump to minimize supply current drain. table 1 summarizes the featur es of the ISL83384E, while application note an9863 summarizes the features of each device comprising the icl32xx 3v family. features ? esd protection for rs-232 i/o pins to 15kv (iec61000) ? drop in replacement for max3384e, sp385e ? low power, pin compatible upgrade for 5v max222, sp310e, adm222, and lt1780 ? single shdn pin disables transmitters and receivers ? meets eia/tia-232 and v.28/v .24 specifications at 3v ? rs-232 compatible with v cc = 2.7v ? latch-up free ? on-chip voltage converters require only four external 0.1 f capacitors ? receiver hysteresis for improved noise immunity ? very low supply current . . . . . . . . . . . . . . . . . . . . 0.3ma ? guaranteed minimum data rate . . . . . . . . . . . . 250kbps ? guaranteed minimum slew rate . . . . . . . . . . . . . . . 6v/ s ? wide power supply range . . . . . . . single +3v to +5.5v ? low supply current in powerdow n state. . . . . . . . . .<1 a applications ? any system requiring rs-232 communication ports - battery powered, hand-hel d, and portable equipment - laptop computers, notebooks, palmtops - modems, printers and other peripherals - digital cameras - cellular/mobile phones related literature ? technical brief tb363 ?guidelines for handling and processing moisture sensit ive surface mount devices (smds)? ? an9863, ?3v to +5.5v, 250k-1mbps, rs-232 transmitters/receivers? ordering information part number temp. range (c) package pkg. dwg. # ISL83384Eca 0 to 70 20 ld ssop m20.209 ISL83384Eca-t 0 to 70 tape and reel m20.209 table 1. summary of features part number no. of tx. no. of rx. no. of monitor rx. (r outb ) data rate (kbps) rx. enable function? ready output? manual power- down? automatic powerdown function? ISL83384E 2 2 0 250 no no yes no data sheet june 2004
2 pinout ISL83384E (ssop) top view nc c1+ v+ c1- c2+ c2- v- t2 out r2 in shdn gnd t1 out r1 in r1 out t2 in nc v cc t1 in r2 out 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 nc pin descriptions pin function v cc system power supply input (3.0v to 5.5v). v+ internally generated positiv e transmitter supply (+5.5v). v- internally generated negative transmitter supply (-5.5v). gnd ground connection. c1+ external capacitor (voltage dou bler) is connected to this lead. c1- external capacitor (voltage dou bler) is connected to this lead. c2+ external capacitor (voltage invert er) is connected to this lead. c2- external capacitor (voltage invert er) is connected to this lead. t in ttl/cmos compatible transmitter inputs. t out 15kv esd protected , rs-232 level (nominally 5.5v) transmitter outputs. r in 15kv esd protected , rs-232 compatible receiver inputs. r out ttl/cmos level receiver outputs. shdn active low input to shut down transmitters, receivers, and on-board power supply, to place device in low power mode. typical operating circuit ISL83384E 19 v cc t1 out t2 out t1 in t2 in t 1 t 2 0.1 f + 0.1 f + 0.1 f 14 13 17 8 2 4 3 7 v+ v- c1+ c1- c2+ c2- + 0.1 f 5 6 r1 out r1 in 16 5k ? r2 out r2 in 9 12 5k ? 15 c 1 c 2 + c 3 c 4 shdn gnd 20 +3.3v to +5v + 0.1 f 18 v cc ttl/cmos logic levels rs-232 levels r 1 r 2 + c 3 (optional connect ion, note 1) notes: 1. the negative terminal of c 3 can be connected to either v cc or gnd. ISL83384E
3 absolute maximum rati ngs thermal information v cc to ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 6v v+ to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 7v v- to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3v to -7v v+ to v- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14v input voltages t in , shdn . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 6v r in . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25v output voltages t out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2v r out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to v cc +0.3v short circuit duration t out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous esd rating . . . . . . . . . . . . . . . . . . . . . . . . . see specification table thermal resistance (typical, note 2) ja (c/w) 20 ld ssop package . . . . . . . . . . . . . . . . . . . . . . . 125 maximum junction temperature (plastic package) . . . . . . . 150c maximum storage temperature range . . . . . . . . . . -65c to 150c maximum lead temperature (soldering 10s) . . . . . . . . . . . . 300c (lead tips only) operating conditions temperature range ISL83384Ecx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0c to 70c caution: stresses above those listed in ?abs olute maximum ratings? may cause permanent dam age to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. note: 2. ja is measured with the component mounted on a low effective ther mal conductivity test board in free air. see tech brief tb379 fo r details. electrical specifications test conditions: v cc = 3v to 5.5v, c 1 - c 4 = 0.1 f; unless otherwise specified. typicals are at t a = 25c parameter test conditions temp (c) min typ max units dc characteristics supply current, powerdown shdn = gnd 25 - 0.1 5 a full - 1 50 a supply current, enabled all outputs unloaded, shdn = v cc full - 0.3 3.0 ma logic and transmitter inputs and receiver outputs input logic threshold low t in , shdn full - - 0.8 v input logic threshold high t in , shdn full 2.4 - - v input leakage current t in , shdn full - 0.01 1.0 a output leakage current shdn = gnd full - 0.05 10 a output voltage low i out = 3.2ma full - - 0.4 v output voltage high i out = -1.0ma full v cc -0.6 v cc -0.1 - v receiver inputs input voltage range full -25 - 25 v input threshold low v cc = 3.3v 25 0.6 1.2 - v v cc = 5.0v full 0.8 1.5 - v input threshold high v cc = 3.3v 25 - 1.5 2.4 v v cc = 5.0v full - 1.8 2.4 v input hysteresis full 0.2 0.5 1 v input resistance full 3 5 7 k ? transmitter outputs output voltage swing all transmitter outputs loaded with 3k ? to ground full 5.0 5.4 - v output resistance v cc = v+ = v- = 0v, transmitter output = 2v full 300 10m - ? output short-circuit current full 7 35 - ma output leakage current v out = 12v, v cc = 0v or 3v to 5.5v, shdn = gnd full - - 10 a timing characteristics maximum data rate r l = 3k ?, c l = 1000pf, one transmitter switching full 250 500 - kbps ISL83384E
4 detailed description the ISL83384E operates from a single +3v to +5.5v supply, guarantees a 250kbps minimum da ta rate, requires only four small external 0.1 f capacitors, features low power consumption, and meets all ela rs-232c and v.28 specifications. the circuit is di vided into three sections: the charge pump, the transmitters, and the receivers. charge-pump intersil?s new ISL83384E utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate 5.5v transmitter supplies from a v cc supply as low as 3.0v. this allows these devices to maintain rs-232 compliant output levels over the 10% tolerance range of 3.3v powered systems. the effi cient on-chip power supplies require only four small, external 0.1 f capacitors for the voltage doubler and inverter functions over the full v cc range. the charge pumps operate discontinuously (i.e., they turn off as soon as the v+ and v- supplies are pumped up to the nominal values), resulting in significant power savings. transmitters the transmitters are proprietary, low dropout, inverting drivers that translate ttl/cm os inputs to eia/tia-232 output levels. coupled with the on-chip 5.5v supplies, these transmitters deliver tr ue rs-232 levels over a wide range of single supply system voltages. all transmitter outputs disable and assume a high impedance state when the device enters the powerdown mode (see table 2). these outputs may be driven to 12v when disabled. all devices guarantee a 250kbps data rate for full load conditions (3k ? and 1000pf), v cc 3.0v, with one transmitter operating at full speed. under more typical conditions of v cc 3.3v, r l = 3k ? , and c l = 250pf, one transmitter easily operates at 900kbps. transmitter inputs float if left unconnected (there are no pull- up resistors), and may cause i cc increases. connect unused inputs to gnd for the best performance. receivers the ISL83384E contains standard inverting receivers that three-state via the shdn control line. receivers driving powered down peripherals must be disabled to prevent current flow through the peripher al?s protection diodes (see figures 2 and 3). transmitter propagation delay transmitter input to transmitter output, c l = 1000pf t phl full - 0.6 3.5 s t plh full - 0.7 3.5 s receiver propagation delay receiver input to receiver output, c l = 150pf t phl full - 0.2 1 s t plh full - 0.3 1 s transmitter output enable time from shdn rising edge to t out = 3v 25 - 50 - s transmitter output disable time from shdn falling edge to t out = 5v 25 - 600 - ns transmitter skew t phl - t plh (note 3) 25 - 100 - ns receiver skew t phl - t plh 25 - 100 - ns transition region slew rate r l = 3k ? to 7k ?, measured from 3v to -3v or -3v to 3v v cc = 3.3v, c l = 150pf to 2500pf 25 4 - - v/ s v cc = 4.5v, c l = 150pf to 2500pf 25 6 - - v/ s esd performance rs-232 pins (t out , r in ) human body model 25 - 15 - kv iec61000-4-2 contact discharge 25 - 8-kv iec61000-4-2 air gap discharge 25 - 15 - kv all other pins human body model 25 - 3-kv note: 3. transmitter skew is measured at t he transmitter zero crossing points. electrical specifications test conditions: v cc = 3v to 5.5v, c 1 - c 4 = 0.1 f; unless otherwise specified. typicals are at t a = 25c (continued) parameter test conditions temp (c) min typ max units table 2. powerdown and enable logic truth table shdn input transmitter outputs receiver outputs mode of operation h active active normal operation l high-z high-z manual powerdown ISL83384E
5 all the receivers convert rs-232 signals to cmos output levels and accept inputs up to 30v while presenting the required 3k ? to 7k ? input impedance (see figure 1) even if the power is off (v cc = 0v). the receivers? schmitt trigger input stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. low power operation this 3v device requires a nominal supply current of 0.3ma, even at v cc = 5.5v, during normal operation (not in powerdown mode). this is cons iderably less than the 11ma current required by comparable 5v rs-232 devices, allowing users to reduce system power simply by replacing the old style device with the ISL83384E. low power, pin compatible replacement pin compatibility with existing 5v products (e.g., max222), coupled with the wide operating supply range, make the ISL83384E a potential lower power, higher performance drop-in replacement for existing 5v applications. as long as the 5v rs-232 output swings are acceptable, and transmitter pull-up resistors ar en?t required, the ISL83384E should work in most 5v applications. when replacing a device in an existing 5v application, it is acceptable to terminate c 3 to v cc as shown on the ?typical operating circuit?. nevertheless, terminate c 3 to gnd if possible, as slightly better performance results from this configuration. powerdown functionality the already low current requirement drops significantly when the device enters powerdown mode. in powerdown, supply current drops to 1 a, because the on-chip charge pump turns off (v+ collapses to v cc , v- collapses to gnd), and the transmitter and receiver outputs three- state. this micro-power mode makes these devices ideal for battery powered and portable applications. software controlled (manual) powerdown the ISL83384E may be forced into its low power, standby state via a simple shutdown (shdn ) pin (see figure 4). driving this pin high enables normal operation, while driving it low forces the ic into it s powerdown state. the time required to exit powerdown, and resume transmission is less than 50 s. connect shdn to v cc if the powerdown function isn?t needed. r xout gnd v rout v cc 5k ? r xin -25v v rin +25v gnd v cc figure 1. inverting receiver connections figure 2. power drain through powered down peripheral old v cc powered gnd shdn = gnd v cc rx tx v cc current v out = v cc flow rs-232 chip down uart figure 3. disabled receivers prevent power drain ISL83384E transition detector r x t x v cc v cc to v out = hi-z wake-up logic powered down uart v- figure 4. connections for manual powerdown pwr shdn cpu i/o ISL83384E mgt logic uart ISL83384E
6 capacitor selection the charge pumps require 0.1 f or greater capacitors for operation with 3.3v v cc 5.5v. increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduc es power consumption. c 2 , c 3 , and c 4 can be increased without increasing c 1 ?s value, however, do not increase c 1 without also increasing c 2 , c 3 , and c 4 to maintain the proper ratios (c 1 to the other capacitors). when using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. if in dou bt, use capacitors wit h a larger nominal value. the capacitor?s equivalent series resistance (esr) usually rises at low temperatures and it influences the amount of ripple on v+ and v-. operation down to 2.7v ISL83384E transmitter outputs meet rs-562 levels ( 3.7v), at the full data rate, with v cc as low as 2.7v. rs-562 levels typically ensure interoperability with rs-232 devices. power supply decoupling in most circumstances a 0.1 f bypass capacitor is adequate. in applications that are particularly sensitive to power supply noise, decouple v cc to ground with a capacitor of the same value as the charge-pump capacitor c 1 . connect the bypass capac itor as close as possible to the ic. transmitter outputs when exiting powerdown figure 5 shows the response of two transmitter outputs when exiting powerdown mode. as they activate, the two transmitter outputs properly go to opposite rs-232 levels, with no glitching, ringing, nor undesirable transients. each transmitter is loaded with 3k ? in parallel with 2500pf. note that the transmitters enable only when the magnitude of the supplies exceed approximately 3v. high data rates the ISL83384E maintains the rs-232 5v minimum transmitter output voltages even at high data rates. figure 6 details a transmitter loopback test circuit, and figure 7 illustrates the loopback test resu lt at 120kbps. for this test, all transmitters were simultaneously driving rs-232 loads in parallel with 1000pf, at 12 0kbps. figure 8 shows the loopback results for a single transmitter driving 1000pf and an rs-232 load at 250kbps. the static transmitter was also loaded with an rs-232 receiver. time (20 s/div) t1 t2 2v/div 5v/div v cc = +3.3v shdn figure 5. transmitter outputs when exiting powerdown c1 - c4 = 0.1 f figure 6. transmitter loopback test circuit figure 7. loopback test at 120kbps ISL83384E v cc c 1 c 2 c 4 c 3 + + + + 1000pf v+ v- 5k t in r out c1+ c1- c2+ c2- r in t out + v cc 0.1 f v cc shdn t1 in t1 out r1 out 5 s/div v cc = +3.3v 5v/div c1 - c4 = 0.1 f ISL83384E
7 interconnection with 3v and 5v logic the ISL83384E directly interfaces with 5v cmos and ttl logic families. nevertheless, with the device at 3.3v, and the logic supply at 5v, ac, hc, and cd4000 outputs can drive ISL83384E inputs, but ISL83384E outputs do not reach the minimum v ih for these logic families. see table 3 for more information. 15kv esd protection all pins on isl83xxx devi ces include esd protection structures, but the isl83384 e incorporates advanced structures which allow the rs-232 pins (transmitter outputs and receiver inputs) to survive esd events up to 15kv. the rs-232 pins are particularly vulnerable to esd damage because they typically connect to an exposed port on the exterior of the finished pro duct. simply touching the port pins, or connecting a cable, can cause an esd event that might destroy unprotected ics. these new esd structures protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and don?t interfere with rs-232 signals as large as 25v. human body model (hbm) testing as the name implies, this test method emulates the esd event delivered to an ic during human handling. the tester delivers the charge through a 1.5k ? current limiting resistor, making the test less severe than the iec61000 test which utilizes a 330 ? limiting resistor. the hbm method determines an ic?s ability to withstand the esd transients typically present during handling and manufacturing. due to the random nature of these ev ents, each pin is tested with respect to all other pins. the rs-232 pins on ?e? family devices can withstand hbm esd events to 15kv. iec16000-4-2 testing the iec61000 test method applies to finished equipment, rather than to an individual ic. therefore, the pins most likely to suffer an esd event are th ose that are exposed to the outside world (the rs-232 pins in this case), and the ic is tested in its typical application configuration (power applied) rather than testing each pin-to -pin combination. the lower current limiting resistor coupled with the larger charge storage capacitor yields a test t hat is much more severe than the hbm test. the extra esd protection built into this device?s rs-232 pins allows the design of equipment meeting level 4 criteria with out the need for additional board level protection on the rs-232 port. air-gap discharge test method for this test method, a charged probe tip moves toward the ic pin until the voltage arcs to it. the current waveform delivered to the ic pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. the ?e? device rs-232 pins withstand 15kv air-gap discharges. contact discharge test method during the contact discharge te st, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. the result is a mo re repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 8kv. all ?e? family devices survive 8kv contact discharges on the rs-232 pins. figure 8. loopback test at 250kbps table 3. logic family compatibility with various supply voltages system power-supply voltage (v) v cc supply voltage (v) compatibility 3.3 3.3 compatible with all cmos families. 5 5 compatible with all ttl and cmos logic families. 5 3.3 compatible with act and hct cmos, and with ttl. ISL83384E outputs are incompatible with ac, hc, and cd4000 cmos inputs. t1 in t1 out r1 out 2 s/div 5v/div v cc = +3.3v c1 - c4 = 0.1 f ISL83384E
8 die characteristics substrate potential (powered up) gnd transistor count 338 process si gate cmos typical performance curves v cc = 3.3v, t a = 25c figure 9. transmitter output voltage vs load capacitance figure 10. slew rate vs load capacitance figure 11. supply current vs load capacitance when transmitting data figure 12. supply current vs supply voltage -6.0 -4.0 -2.0 0 2.0 4.0 6.0 1000 2000 3000 4000 5000 0 load capacitance (pf) transmitter output voltage (v) 1 transmitter at 250kbps v out + v out - 1 transmitter at 30kbps load capacitance (pf) slew rate (v/ s) 0 1000 2000 3000 4000 5000 5 10 15 20 25 +slew -slew 0 5 10 15 20 25 30 45 35 40 0 1000 2000 3000 4000 5000 load capacitance (pf) supply current (ma) 20kbps 250kbps 120kbps supply current (ma) 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 0.5 1.0 1.5 2.0 supply voltage (v) 2.5 3.0 3.5 no load all outputs static ISL83384E
9 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality ce rtifications can be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corporation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that da ta sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com ISL83384E shrink small outline plastic packages (ssop) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. dimension ?e? does not include interlead flash or protrusions. in- terlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of ?b? dimension at maximum material condition. 10. controlling dimension: millimeter. converted inch dimen- sions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m b s e -a- b m -c- a1 a seating plane 0.10(0.004) c h 0.25(0.010) b m m l 0.25 0.010 gauge plane a2 m20.209 (jedec mo-150-ae issue b) 20 lead shrink small outline plastic package symbol inches millimeters notes min max min max a 0.068 0.078 1.73 1.99 a1 0.002 0.008? 0.05 0.21 a2 0.066 0.070? 1.68 1.78 b 0.010? 0.015 0.25 0.38 9 c 0.004 0.008 0.09 0.20? d 0.278 0.289 7.07 7.33 3 e 0.205 0.212 5.20? 5.38 4 e 0.026 bsc 0.65 bsc h 0.301 0.311 7.65 7.90? l 0.025 0.037 0.63 0.95 6 n20 207 0 deg. 8 deg. 0 deg. 8 deg. rev. 3 11/02
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